![]() (OPSI) said in comments to the Federal Energy Regulatory Commission (FERC). The PJM interconnection process is set forth in a Tariff, which provides a step-by- step process for all participants to follow. Two types of temporary bonding adhesives having different softening temperatures are used in conjunction with two temporary carriers, and a temporary bonding process and a bonding release process are used, thereby ensuring that the ultra-thin semiconductor wafer is supported by the temporary carrier during three-dimensional integration processes such as transferring, holding, interconnection structure fabrication, and bonding, and effectively reducing the risk of wafer cracking during the integration process. The grid operator PJM would not begin processing new interconnection requests until 2026 and then would take two years to complete each interconnection study, under its proposed timelines, the Organization of PJM States, Inc. All projects seeking interconnection into the PJM system must undergo detailed power engineering studies to make sure the project does not impact the reliability of the electric grid. Customer provides the necessary notice and/or evidence that generation facility construction is. Customer executes an interconnection agreement and submits payments, if required. Under the New Rules, each Cycle is a discrete and self-contained process, consisting of three Phases, each of which involves an interconnection study. ![]() The main steps comprise: 1) spin-coating a first temporary bonding adhesive (3) on a front surface of a first temporary carrier (2) 2) bonding a front surface of an ultra-thin semiconductor wafer to the front surface of the first temporary carrier 3) spin-coating a second temporary bonding adhesive (5) on a front surface of a second temporary carrier (4) 4) bonding a rear surface of the ultra-thin semiconductor wafer to the front surface of the second temporary carrier 5) separating the ultra-thin semiconductor wafer from the first temporary carrier 6) fabricating an integrated interconnection structure 7) performing a bonding integration process and 8) separating the integrated wafer from the second carrier. The proposed revised study process (PDF) is designed to streamline the connection of new generation to PJM’s grid and give developers greater cost certainty for their projects while maintaining the reliability of the system. Agreements necessary for the interconnection are presented to the customer for signature, including any charges related to new or upgraded facilities. so within PJM’s defined interconnection process. PJM Interconnection, LLC Transmission Planning PO Box 825682 Philadelphia, PA 19182-5682 Any questions call (610) 666-2312. 40 B.3.4 Generation Project Excess MW Capabilities. (PC) as part of a Quick Fix stakeholder process.20 PJM initiated the Quick Fix stakeholder process at the JanuPC meeting, during which PJM reviewed the relevant. steps that could be taken to mitigate the market power. B.3.3 Cost Allocation Method for Generator and/or Generator Step Up (GSU) Changes. 6 PJM Interconnection, L.L.C., Docket No. The present application discloses a method for holding an ultra-thin semiconductor wafer (1) in a semiconductor integration process. Section 3: Small Resource Interconnection Process.
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